Asia’s contract chip makers will likely see their earnings improve sharply this year as the global economic recovery lifts demand, and as more semiconductor companies world wide, facing pricing pressures and hefty investment burden to build cutting edge factories, look to outsource more production.
Rising outsourcing orders, especially from Japanese integrated device manufacturers such as NEC Electronics Corp. and Fujitsu Microelectronics Ltd., are likely to lift the earnings of contract chip makers Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. of Taiwan, analysts say.
Both NEC and Fujitsu are IDMs traditional chipmakers that handle semiconductor manufacturing in-house. But as they continue to struggle with losses, analysts say they are expected to boost outsourcing to save production costs.
Fujitsu Microelectronics last year unveiled a “fab-lite” strategy, meaning it would outsource production without building new semiconductor fabs. The company inked a deal to outsource production of advanced semiconductor devices to TSMC.
“Fujitsu Microelectronics plans to start and expand 40-nanometer production at TSMC’s fabs this year for use in applications such as digital audio, video, mobile, game and high end servers,” said Adam Blankenship, a spokesman at Fujitsu.
He said the Japanese company agreed in August to develop advanced 28-nanometer process technology of logic chips jointly with TSMC and outsource production to its Taiwanese partner. The company, however, declined to disclose how much of its total chip production is outsourced.
“Integrated device manufacturers are facing tighter budget constraints like never before. For them to survive it is imperative that companies follow a two-pronged strategy, of outsourcing manufacturing of next generations nodes to specialist foundries and co-developing process technology to meet the time to market goals,” said Akkaraju Venkata Sridevi, analyst at California based consulting firm Frost & Sullivan.
NEC Electronics spokeswoman Kyoko Okamoto said the company plans to “minimize [fab] investment down to a necessary level and adopt a compound IDM structure, utilizing both in-house production and outsourcing.” She declined to disclose further specifics and the names of its partners.
Research firm Nomura International expects revenue in the contract-chip market to jump roughly 30% this year to at least US$20 billion from US$15 billion in 2009, driven by IDMs’ increasing moves to outsource production. The firm expects growth in the contract chip market to outpace growth in the overall semiconductor market this year. Gartner expects revenue in the overall semiconductor market to rise 13% this year to US$255 billion from US$226 billion in 2009.
Nomura analyst Rick Hsu expects outsourcing orders by IDM for advanced technology nodes such as 45 nanometer and below—to contribute US$2 billion-US$3 billion in revenue to the contract-chip making sector this year, or about 10%-15% of total contract chip making revenue.
A chip’s transistor components and the spaces between them are measured in nanometers. The smaller and more closely transistors can be packed together, the more powerful the chip.
Asian chip makers are upbeat about their growth prospects this year. Both TSMC and UMC, the world’s two biggest contract chip makers, have reported sharply improved earnings in the fourth quarter, reflecting optimism surrounding the sector.
Last month, TSMC reported its highest quarterly net profit in two years, underpinned by a recovery in global chip demand. TSMC said its net profit for the three months ended Dec. 31 was NT$32.67 billion, up from NT$12.45 billion a year earlier. TSMC’s factories are now operating at full capacity, and there is a capacity shortage particularly in advanced technologies, TSMC Chairman Morris Chang said.
UMC Spokeman Richard Yu said the company’s revenue from IDMs has been about 20% of UMC’s total revenue in the last few quarters.
“This is actually very positive since it shows that IDMs are continuing to come to foundry despite having their own fabs, since UMC can offer competitive yields/cycle times with the added advantage of manufacturing flexibility. We however are still working on improving the revenue contribution from Japanese chip design companies,” Mr. Yu said.
UMC, the world’s second-largest contract chip maker by revenue after TSMC, this month posted a net profit of NT$4.4 billion for the three months ended Dec. 31, reversing a record net loss of NT$23.51 billion a year earlier.
“In 2010, both the foundry industry and our operations will have very positive growth,” UMC Chief Executive Shih-Wei Sun said. “We raised our capital expenditure in expanding capacity and in research and development in advanced technologies.”
Both TSMC and UMC declined to provide specific earnings forecasts for this year.
Still, competition could get more intense with the emergence of another industry player. Globalfoundries, majority owned by Advanced Micro Devices Inc. and Abu Dhabi-funded Advanced Technology Investment Co., bought Singapore-based contract ship maker Chartered Semiconductor Manufacturing International Ltd. last year for US$1.8 billion in cash. The company has said the overall macroeconomic and chip foundry markets are very strong and it sees strong growth shaping up for 2010. It is targeting double-digit revenue growth, without providing further specifics.
“What’s interesting is the further movement by integrated design manufacturers to adapt the ‘fablite’ model,” said Douglas Grose, chief executive at Globalfoundries. “A lot of that could be centered around Japan and some of the companies that have consolidated there, to get their growth and capability in place, they need to move towards the ‘fablite’ model. The outsourcing trend will continue.”
Source:http://online.wsj.com/article/SB10001424052748704751304575079292109567342.html?mod=WSJ_Tech_LEFTTopNews